Rs.19435 Million New 3D Semiconductor Chip Packaging Unit in Bhubaneswar, Odisha

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Project Basic Details

Updated on: 20 April 2026

Basic Details Information
Project Promoter Subscribers Only
Ownership Type Private Sector
Industry Manufacturing
Subcategory Electronics, Semiconductors & Data Centers
Products & Capacity Glass panels (70000 units per year), Assembled semiconductor units (50000000 units per year), 3DHI modules (13200 units per year)
Location Info Valley, Bhubaneswar
District Khordha
State Odisha
Investment From 5000 Million to 49999 Million
Status Under Implementation
Endproduct Electronics, Semiconductors & Data Centers

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